Projects / New in 2026
BOND-AI: A Standardized Reliability Qualification Methodology for High-Temperature Printed Interfaces and Bond Joints, Enabled by Physics-Informed AI, on a 500 °C-Capable Alumina Platform
$1.0MNextFlex (FlexTech Alliance)
Oct 2026, 12 monthsperiod
0papers acknowledging the award
0lab students and alumni on the work
The project
A qualification methodology for printed interfaces and bond joints that must survive 500 °C, using physics-informed AI to predict reliability rather than test it one sample at a time.
PI Alkim Akyurtlu (Director, RURI and PERC); Co-PIs Vinod Vokkarane, Oshadha Ranasingha, and Scott Stapleton; with Applied Nanotech, Bayflex Solutions, RAGE Systems, and RTX.
Students
No lab students are identified on this project in the records yet.
Acknowledging this award
This material is based upon work supported by the NextFlex. Any opinions, findings, and conclusions or recommendations expressed are those of the authors and do not necessarily reflect the views of the sponsor.